Low pressure injection molding process is a very low injection pressure will hot melt material into the mold and fast curing molding packaging process (speed only 1-50 seconds), hot melt as a material, has excellent sealing and excellent physics, product performance to insulation, temperature resistance, impact resistance, shock absorption, moisture, water, dust resistance, chemical corrosion resistance and other effects.

The process is currently used in the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCB), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, microswitches, inductors, antennas, etc.

Low pressure injection molding plays a good role in protecting electronic components. Traditional injection molding process has defects due to high pressure, because low pressure molding only needs a small pressure to make the melt flow into a small mold space, so it will not damage the fragile components to be packaged, greatly reducing the rejection rate, low pressure injection molding process not only environmental protection, but also greatly improve the production efficiency can help reduce the total cost of production.

Low pressure injection molding hot melt adhesive. The material is capable of reaching small areas without high pressure, making it ideal for sensors. The bonding properties of polyamide provide optimal adhesion and can effectively seal moisture and other environmental contaminants. The high chemical resistance to oil, diesel oil, grease and weak acid of the low pressure molding hot melt adhesive represented by polyamide also improves the performance of the finished product.

Electrification of automobile industry has brought new development direction for low pressure molding hot melt adhesive industry. Due to its particularity, the automobile industry has high requirements on the durability and stability of parts, so the low pressure forming process has a good application prospect. With the new energy revolution in the automobile industry, more and more electronic devices are applied in the automobile, which brings new development opportunities for the low pressure molding process.

The global hot melt adhesive market for low pressure molding reached $242 million in 2022 and is expected to reach $387 million in 2029, with a compound annual growth rate (CAGR) of 7.96%.

From the historical data, from 2018 to 2021, due to the downward trend of the consumer electronics industry and the cumulative impact of the COVID-19 pandemic, the development of low-pressure molding hot melt adhesive slowed down and the market entered a period of adjustment. Since 2021, with the thin development of the new energy automobile industry and the electrification transformation of automobiles, the industry has ushered in a new growth point again. At the same time, the consumer electronics industry is seeing new growth opportunities with home-based learning.

At the regional level, the Chinese market has changed rapidly in the past few years. In 2022, the market size is 57.62 million US dollars, accounting for 23.84% of the world, and it is expected to reach 98.86 million US dollars in 2029, when the global share will reach 25.54%.

China is in a leading position in the electronics, new energy vehicles and semiconductor packaging industries, so the demand for low-voltage molding hot melt adhesive is relatively strong, and it is the largest market at present, and there is still a relatively large room for growth in the future.

In terms of product type and technology, polyamide occupies the main market share, with product sales revenue reaching $217.60 million in 2022, accounting for 90.03% of the overall market, and is expected to reach $349.34 million in 2029, when the global share will reach 90.23%.

In terms of product market application, consumer electronics is currently the main downstream market, but the demand of this market is slowing down, and the automotive industry is growing more rapidly, with a compound annual growth rate (CAGR) of 9.31% from 2023 to 2029.